interconnect changes for 6.7
This pull request contains the interconnect changes for the 6.7-rc1 merge
window which contains just driver changes with the following highlights:
Driver changes:
- New interconnect driver for the SDX75 platform.
- Support for coefficients to allow node-specific rate adjustments.
- Update DT bindings according to the recent changes of how we
represent the SMD and RPM bus clocks on Qualcomm platforms.
- Misc fixes and cleanups.
Signed-off-by: Georgi Djakov <djakov@kernel.org>
Merge branch 'icc-platform-remove' into icc-next
Convert platform drivers to use the .remove_new callback.
* icc-platform-remove
interconnect: qcom: Convert to platform remove callback returning void
Link: https://lore.kernel.org/r/20231015135955.1537751-2-u.kleine-koenig@pengutronix.de
Signed-off-by: Georgi Djakov <djakov@kernel.org>
