blob: c4add12f1485df65c83c37c5ae5514e97db05732 [file] [log] [blame]
From b09a48a3f84cc28dea31822db22fcbcd14e68aef Mon Sep 17 00:00:00 2001
From: Stephen Hemminger <shemminger@vyatta.com>
Date: Thu, 11 Jun 2009 05:46:04 -0700
Subject: bonding: fix multiple module load problem
From: Stephen Hemminger <shemminger@vyatta.com>
[ Upstream commit 130aa61a77b8518f1ea618e1b7d214d60b405f10 ]
Some users still load bond module multiple times to create bonding
devices. This accidentally was broken by a later patch about
the time sysfs was fixed. According to Jay, it was broken
by:
commit b8a9787eddb0e4665f31dd1d64584732b2b5d051
Author: Jay Vosburgh <fubar@us.ibm.com>
Date: Fri Jun 13 18:12:04 2008 -0700
bonding: Allow setting max_bonds to zero
Note: sysfs and procfs still produce WARN() messages when this is done
so the sysfs method is the recommended API.
Signed-off-by: Stephen Hemminger <shemminger@vyatta.com>
Signed-off-by: Jay Vosburgh <fubar@us.ibm.com>
Signed-off-by: David S. Miller <davem@davemloft.net>
Signed-off-by: Greg Kroah-Hartman <gregkh@suse.de>
---
drivers/net/bonding/bond_sysfs.c | 1 +
1 file changed, 1 insertion(+)
--- a/drivers/net/bonding/bond_sysfs.c
+++ b/drivers/net/bonding/bond_sysfs.c
@@ -1538,6 +1538,7 @@ int bond_create_sysfs(void)
printk(KERN_ERR
"network device named %s already exists in sysfs",
class_attr_bonding_masters.attr.name);
+ ret = 0;
}
return ret;